Xiaomi’s upcoming flagship smartphone, the Xiaomi Mi5 has
been one of the anticipated smartphone to be unveil in the upcoming Mobile World
Congress, in Barcelona few weeks from now. Many smartphone fanatic expected
that the Xiaomi Mi5 will released last year, but it did not happen. And it will
was being expected that it will be launch first quarter of the year.
It was being confirmed that Xiaomi’s upcoming flagship
smartphone, the Mi5 will be powered by Qualcomm’s latest chipset, the
Snapdragon 820. But unfortunately, the smartphone will not have Quad HD
display, instead it will have 1080p Full HD display. This smartphone will have
dual-sim card slot inside.
According to the rumors around, Xiaomi Mi5 will have a 3GB
and 4GB of RAM variant inside. A 16-megapixel OIS camera in the back and a 3600
mAh battery. The body will have an all-metal and metal+glass variants; that
will be ship with a multiple storage variants. The smartphone will run the
latest Android Marshmallow together with Android-based MIUI OS. Also there is a
rumor that, the home key will placed below the display and it will act also as
a finger print scanner.
In the picture below, we see the latest alleged leak parts of
Mi5. It is the alleged back panel of Xiaomi Mi5, the back panel look sleek in
the photo. From the first look its look a metal in the back. But if you watch
for the second time, it’s kind of a glass. Now, we can see differently from
far, it’s not slightly curved as one’s we’ve been seen so far. This photo might
indicate the leak is false, or Xiaomi is going to release an allmetal and
metal+glass variants of the smartphone.
image from Weibo.com
Stay tuned for upcoming leaks about Xiaomi Mi5.
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